
High Performance Wire Saw Machine - Ultra-thin Silicon Wafer Precision Cutting | High Open Probability, Stable Operation, Efficient Process Solidification
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Product Specifications
Material | Steel |
Dimensions | Large |
Power | High |
Weight | Heavy |
Precision | High |
Control | Servo |
Capacity | Large |
Features | High Efficiency, Low Cost, Precise Cutting, Stable Operation, Process Solidification, Ultra-Thin Wafers, High Precision |
FOB Port | Shanghai/Ningbo |
Payment Terms | Western Union, Telegraphic Transfer (T/T), Others |
Supply Ability | 30-50sets Per Month |
Delivery Time | 3 Months |
Sample Policy | Contact us for information regarding our sample policy |
Main Export Market(s) | Asia |
Main Domestic Market | All India |
Product Overview
Key Features
This machine is specially designed for the solar silicon wafer industry, and it is suitable for cutting poly silicon, mono crystalline silicon and other silicon materials.
Diamond wire special machine, high open probability, greatly improve cutting efficiency and reduce processing cost;
* After years of high precision servo control technology, ultra-thin silicon wafer and ultra-fine diamond wire can be precisely cut and processed.
* With stable operation and process oriented equipment design concept, to achieve the process solidification in the equipment, to create the maximum value for the customer.
Company Details
Focusing on a customer-centric approach, Zhejiang Dacheng Electric Joint Stock Co.,Ltd. has a pan-India presence and caters to a huge consumer base throughout the country. Buy Cutting Machine in bulk from Zhejiang Dacheng Electric Joint Stock Co.,Ltd. at Trade India quality-assured products.
Business Type
Exporter, Manufacturer
Employee Count
100
Establishment
2008
Working Days
Monday To Sunday
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Seller Details
Shangyu, Zhejiang
Caroline
Address
No.206, Tongjiang Mid-road, Caoe Street, Shangyu district, Shaoxing City, Shangyu, Zhejiang, 312300, China
wire saw machine in Shangyu
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