Laptop Mini Bga Rework Machine Chinafix Cf300t

We are offering our customers a wide range of Laptop Mini BGA Rework Machine CHINAFIX CF300T, which are available following Specifications :-
Model:CHINAFIX CF300T
Solder Type:Leaded Solder/Lead Free
Suitable SMD Type:Micro bga,BGA,CSP,QFP
PCB Thickness:0.5mm~4mm
PCB Size:415mm*325mm --- 80mm*80mm
Heating Mode/Power(Upper):Hot-blast air /650W
Heating Mode/Power(Bottom):Hot-blast air /650W
Preheating Mode/Power:IR / 700w
PCB Location Mode:Shape or Tongs
Driving Mode:Driving By Stepping Motor
Control Mode:Touch-screen + PLC
Temperature Range:Room Temperature 0~400A C
Max Power:2000W
Supply Voltage:110V/220V
Machine Dimension:530mm(L)*385mm(W)*500mm(H)
Weight:18KG

Machine Characteristic
1. Hot air parts adopt exported ceramics heating chips which heats uniformly and wears well.
2. The support design of three heating area,fine turning to support, in case of welding area to sink
3. Upper & bottom hot air control temperature independently, it can store 10 groups and 16 stages temperature curve.
4. Three temperature zones can be controlled independently to achieve reballing and drying etc function
5. The third temperature zone adopts black infrared heating tube + exported temperature switch control, heating fastly, temperature-control accurately.
6. Machine part adopts high oxidation treatment, main machine chassis adopts thicken material in case of machine modification.
7. Upper heating adopts non-labour stepping motor driver, it can be fine adjusted to relative position exactly.