Wcu Base Plate For Butterfly Packagebase Plate

We are highly veteran manufacturer and exporter of WCu Base Plate For Butterfly Package in Zhuzhou, Hunan, China available with following details.


Description
Tungsten copper base plate, a kind of copper tungsten product, is a term for a component or assembly that transfers heat generated within a solid material to a fluid medium, such as air or a liquid to prevent thermal damage.
Tungsten copper composites, with copper content (by weight) of 10 to 30 percent, are often used to make heat sinks. Tungsten copper heat sinks are developed with unique features such as high thermal conductivity, low thermal expansion rate, and low dielectric constant.

Application
As a copper tungsten product, tungsten copper heat sink is a composite. So both the thermal advantages of copper and the very low expansion characteristics of tungsten can be utilized.
The combination of these two materials results in thermal expansion characteristics similar to those of silicone carbide, aluminum oxide, and beryllium oxide, used as chips and substrates.
Tungsten copper heat sinks are extensively used as thermal mounting plates, chip carriers, tungsten copper flanges, and frames for RF, light emitting diodes and detectors, laser diode packages like pulse, single emitter, bars and complex carriers for optoelectronics amplifiers, receivers, transmitters, tunable lasers, etc.