Semi Automatical Zm-r6200 Bga Rework Station

Function: it could rework, desolder, remove, mount and weld BGA Chip of laptop, xbox360, Play station 3 and mobile Motherboard. such as CPU, south bridge, north bridge.

Feature is, semi automatical operation, touch screen operation and high defination optical alignment vision system. it could clearly and precisely make BGA Chip match with motherboard point.

Specifications:-
* Total power : 4800W Max
* Top heater power : 800W i 1st heateri
* Bottom heater power : 1200W i 2nd heateri
* 3rd IR heater : 2700W (independent controlling left and right IR heaters)
* Power : AC 220VA 10 50/60Hz
* Electrical materials : temperature control system Adopted Dalian University of Technology
* Dimensions : L640*W630*H900mm
* Temperature control : K-type thermocouple (Closed Loop), intelligent temperature compensation system
* Positioning : V type groovei with universal fixture
* P C B size : Max 410A 370mm, Min65A 65mm
* Available BGA chip : 1A 1~ 80A 80mm
* External temperature sensor : 1 piece
* Net weight : 65kg
* Package : Wooden box
* G.W. : 120KG
* Dimension : L75cm*W75cm*H90cm